
Resin Details
Increase the operational efficiency and improve the yield of your electronics manufacturing lines with ESD Resin, a cost-effective solution to create custom ESD-safe production tooling. Use ESD Resin to prototype and validate electronics production workflows, print static-dissipative parts that repel dust and powder, and create enclosures to protect sensitive electronics from static discharge Support print resolutions: 100 µm and 50µm Post-curing required.
Applications
Technical Specs
| Overview | |
|---|---|
| Technology | |
| Material Compatibility | |
| Printer Compatibility | |
| Build Platform Compatibility | |
| Tank Compatibility | |
| Material Properties | |
| Unnotched Izod | |
| Thermal Expansion | |
| Heat Deflection Temp. @ 0.45 MPa | |
| Notched Izod | |
| Flexural Modulus | |
| Tensile Modulus | |
| Elongation at Break | |
| Ultimate Tensile Strength | |
Resin Cheat Sheet
| Product | ESD Resin V1 |
|---|---|
| Cure Temperature | 70 °C |
| Cure Time (Form Cure V1) | |
| Cure Time (Form Cure V2) | 7 min |
| Wash Time | 20 minutes |
| Special Notes | |
| Extra Abrasive to Tanks | -- |