Bambu Lab - PC (1.75mm) 1kg

Bambu Lab - PC (1.75mm) 1kg

Bambu Lab - PC (1.75mm) 1kg

High-strength PC filament with exceptional heat resistance and engineering performance.
$50.99 CAD
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$50.99 CAD

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Filament Details

Performance ratings are intended as a general comparison guide. Refer to the Technical Data Sheet (TDS) for detailed specifications and certified values.
Bambu Lab PC 1.75mm Filament (1KG) is an engineering-grade polycarbonate filament designed for high-strength, heat-resistant applications. It offers outstanding mechanical properties, excellent impact resistance, and superior dimensional stability, making it ideal for demanding functional parts and industrial use. Optimized for reliable printing on Bambu Lab printers, PC is well suited for tooling, prototypes, and end-use components that must withstand mechanical loads and elevated temperatures.
Applications
  • Functional prototypes
  • Industrial tooling and fixtures
  • Mechanical components
  • Structural brackets and mounts
  • Automotive parts
  • Electrical and electronic enclosures
  • Robotics components
  • Manufacturing aids
  • Protective housings
  • Replacement parts
  • Engineering end-use parts
  • Parts requiring high heat and impact resistance

Documentation

Resistant to Oils & Fuels

See TDS for Details

UV resistant

See TDS for Details

Prone to Shrinking.

See TDS for Details

Advanced Material

See TDS for information

Adhesion aid Required

Explore Options

Enclosed Chamber Recommended

Helps prevent warping and layer separation

Technical Specs

Overview
Net Weight 1kg
Material Compatibility
Material Diameter / Thickness 1.75mm

What's in the Box

  • Come with high temperature reusable spool

Product Highlights

Top Features

Features

  • Exceptional Thermal Resistance
  • Excellent Mechanical Properties
  • High Impact Strength and Durability
  • Suitable for Engineering Purposes
  • Comes with High Temperature Reusable Spool
  • Diameter: 1.75mm +/- 0.03mm

Cautions for use

  • Dry out before use
  • AMS Compatible
  • AMS lite NOT Compatible
  • Enclosure Printers Required

Recommended Printing Settings

  • Drying Settings (blast oven drying) : 80 °C，8h
  • Printing and Keeping Container's Humidity: < 20% RH (Sealed, with Desiccant)
  • Nozzle Temperature: 250 - 270 °C
  • Bed Temperature (with Glue): 90 - 110 °C
  • Printing Speed: < 300 mm/s

Physical Properties

  • Density : 1.20 g/cm³
  • Vicat Softening Temperature: 119 °C
  • Heat Deflection Temperature: 117 °C
  • Melting Temperature: 228 °C
  • Melt Index: 32.2 ± 2.9 g/10 min

Mechanical Properties

  • Tensile Strength: 55 ± 4 MPa
  • Breaking Elongation Rate: 3.8 ± 0.3 %
  • Bending Modulus: 2310 ± 70 MPa
  • Bending Strength: 108 ± 4 MPa
  • Impact Strength: 34.8 ± 2.1 kJ/m²

Accessory Compatibility

  • Build Plate: Smooth PEI Plate, Textured PEI Plate
  • Hotend: All Size / Material
  • Glue: Glue Stick